Bachelor of Engineering (Hons.) Electronics

Highlights about course

Program Level

Bachelor

Duration

4 Years

Tuition Fees

RM 76,000

Intake

July, March, September

This programme is designed in consultation with industry experts, keeping it current and relevant to prepare our graduates for an exciting career in various industries, ranging from the electronics industry to multi-disciplinary manufacturing segments. This four-year programme focuses on delivering the knowledge, skills, and expertise required to solve real-world engineering problems.

The programme starts with immersion of engineering fundamentals such as circuit and signal analysis, computer programming, control theory, and microprocessors. These subjects form the bedrock for more advanced and specialised topics ranging from analogue electronics, physical electronics, and semiconductor devices to embedded Internet of Things (IoT) systems, Artificial Intelligence (AI) systems & applications, cybersecurity, robotic & automation and electromagnetic interference to support the Industry Revolution 4.0 (IR 4.0). In addition to the technical courses, the programme also offers professional development modules such as workplace communications, management, accounting, and engineering ethics. In the third and final years, our students undergo industrial training and deliver capstone & final year projects to nurture talent and competency in research, technical design, practical problem-solving, and project management.

Entry Requirements

    1. Pass Foundation/Matriculation studies in related field from a recognised institution; OR
    2. Pass STPM or its equivalent with a minimum of Grade C (GP 2.00) in Mathematics and Physics; OR
    3. Pass A-Level with a minimum of Grade D in Mathematics and Physics; OR
    4. Pass UEC with a minimum of Grade B in at least five (5) subjects inclusive of Mathematics and Physics; OR
    5. Recognised Diploma in Engineering / Engineering Technology or its equivalent with minimum CGPA 2.00; OR
    6. Pass DKM /DLKM/DVM with a minimum CGPA of 2.50. Candidates with CGPA below 2.50 MUST have at least two (2) years of work experience in the related field.*; OR

Note

*DKM /DLKM/DVM candidates may be required to undergo Bridging Programme as an additional requirement.

Programme Structure

Core

Year 1

Engineering Mathematics 1
Circuit Theory
Electronics 1
Computer and Program Design
Field Theory
Electronics 2
Digital Logic Design
Engineering Mathematics 2
Electronics 3
Algorithms and Data Structures
Introduction to Machines & Power Systems
Instrumentation and Measurement Techniques

Year 2

Engineering Mathematics III
Circuits and Signals
Electromagnetic Theory
Microcontroller and Microprocessor Systems
Physical Electronics
Microelectronics Circuit Analysis and Design
Electromagnetic Interference
Computer Organization and Architecture
Industrial Mathematics
Control Theory

Year 3

Analog and Digital Communications
Power Electronics
Digital System
Advanced Microprocessors
Industrial Training
Integrated VLSI Systems
Capstone Project

Year 4

Project
Digital Integrated Circuits
Processing and Fabrication Technology
Data Communications and Computer Networking

Elective Modules

Operating System
Advanced Object-oriented Design with Java
Software Engineering
Multimedia Technology and Applications
Diagnostic Technology
Introductory Data Science
Introductory Data Visualization
VLSI System Design and Modelling Technique
Analog Integrated Circuits
Embedded IoT Systems and Application
Object Oriented Programming with C++
AI System & Application
Cybersecurity
Semiconductor Devices
N/MEMS
Digital Signal Processing
Introductory Mobile Programming

University Subjects

Project Management
Engineer and Society
Law for Engineers
Workplace Communications
Character Building
Character Development
Philosophy and Current Issues
Appreciation of Ethics and Civilisations/Bahasa Melayu Komunikasi*
Integrity and Leadership
Co-curriculum
*International students

Career Prospects

Application Engineer, Design Solution Engineer, Research & Development Engineer, Firmware/Embedded Software Engineer, Test Application Developer, Product Engineer, PCB Design Engineer, Process Engineer, System Integration Engineer, Computer System Architect, or Technical Marketing Engineer.

About University

Multimedia University

Malaysia

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